Graphene Based Thermal Conductive Material_XG
XG Leaf is prepared from xGnP nanosheets and one or more other components. Different components, densities and processes can achieve different heat dissipation capabilities. Special processes can balance the mechanical, electronic and thermal properties of products. Each XG Leaf has its own unique characteristics. XG Leaf < can be widely used in heat dissipation, thermal resistance, EMI shielding, electrodes, barriers and other fields.
XG Leaf® Type：
XG Leaf A： General Electrical Conductive
XG Leaf B： General Thermal Conductive
XG Leaf F： Resistance heating
XG Leaf F： Ultra High Conductivity
With the increase of system integration, smaller size and higher power of electronic components and their applications, the market demand for high-efficiency thermal interface materials is increasing day by day. Traditional thermal interface materials can not fully meet these needs. XG TIM < provides a solution for thermal conduction of high-power electronic components. 。 XG TIM < uses graphene nano-sheet as thermal conductive filler, a small amount of filling can achieve excellent thermal conductivity. XG TIM < can achieve very thin coating thickness, which greatly reduces the user's use of materials while ensuring thermal conductivity.
Conductive thermal conductive ink based on XG graphene nano-chip can be widely used in printing electronics, packaging, heat dissipation and RFID market.